Executive Summary
DFT’s main target is to achieve maximum controllability and observability which helps to improve the yield and reliability of design. IDT helps improve the CVY and also the reliability of the design. Before (Deep Submicron Devices) DSM, reliability testing was done by burn-In testing. Now, IDDQ has replaced almost the Burn-In testing. Current testing is more important for the reliability testing. The main challenge for IDT is to select the threshold values. There are many methods available for the selection of threshold values just for IDT. In DSM, the same IDDQ threshold value is used for all the IDDQ strobes, which will not work in VDSM devices. Therefore, separate IDDQ threshold values used in ever different pattern for testing, which will increase reliability screening.
Project Highlights
The main objective is that if some physical defect is not detected by some pattern, but it will be detected by another, as the threshold value will be changed for each pattern. Experiments have shown that IDT is a good approach to minimize the yield loss and test escape (TE).
