With a proven physical design flow (RTL to GDSII, DFT, DFM), methodologies, and with dedicated subject matter experts, eInfochips has provided silicon turnkey design service to many clients for successful silicon tape-outs. We were the 1st engineering services company to tape-out multiple 16nm SoCs and have taped-out multiple ASICs at 7nm, 5nm and 3nm ASIC technology node. These SoCs have 300 million to 500 million gates (~25*25 mm) and were developed with the focus on power, performance and area requirements(PPA).

We have delivered multiple tape-outs to leading foundries including TSMC, UMC, GF, Toshiba, TI, and SMIC. We also offer DFM (Design for manufacturability)/DFT (Design for testing) and silicon turnkey design services for startups and tier-2 companies.