“We are pleased to welcome eInfochips to the TSMC Design Center Alliance, and we are confident that eInfochip’s expertise will greatly assist our mutual customers in achieving first-time silicon success,” said Dan Kochpatcharin, Head of Design Infrastructure Management Division at TSMC. “TSMC is committed to collaborating with our OIP ecosystem, including eInfochips, to empower designers in achieving their design goals and quickly bringing their innovation to market.”  

With more than 25 years of pioneering experience in ER&D, eInfochips is set to build upon its offering of silicon engineering services through this alliance. The company has been instrumental in the development of next-generation SoCs, ranging from 180nm to 3nm process technologies. 

For additional details on eInfochips’ semiconductor services and its collaboration with TSMC, visit https://www.einfochips.com/partnerships-and-alliances/silicon-partnerships/tsmc-dca/.