eInfochips is a proud member of the Design Center Alliance (DCA) of TSMC’s Open Innovation Platform® (OIP). The TSMC OIP initiative is a comprehensive design technology infrastructure that encompasses all critical integrated circuit implementation areas, reducing design barriers and improving first-time silicon success. TSMC’s Design Center Alliance focuses on chip implementation services and system-level design solution enablement, lowering the design barrier for customers adopting TSMC technology.

eInfochips brings extensive experience, with 400+ successful tapeouts ranging from 180nm to 3nm technology nodes. We have enabled multiple niche ASICs on TSMC’s latest technologies for leading semiconductor giants. Being part of the DCA alliance will provide us early access to the latest implementation technologies, ensuring cutting-edge ASICs with optimized power, performance, and area for our clients. We will have a dedicated team of subject matter experts trained in the latest TSMC implementation techniques, giving our end customers a competitive edge.