Physical Design of Multiple AI-driven Low Geometry ASICs

Executive Summary

As a trailblazer in AI, cloud computing, and online services, our client needed next-level performance for their cutting-edge data centers and search engines. Their ambitious vision? Develop AI-accelerated ASICs using 5nm and 7nm process nodes – a quantum leap in computational power.

But tackling such an audacious chip design demanded a partner with deep expertise in advanced node implementation and a proven track record with TSMC, the world’s leading foundry. That’s where eInfochips came in.

Leveraging our membership in TSMC’s elite Design Center Alliance and mastery of Cadence’s leading-edge EDA tools, we took on the critical physical design and design-for-test implementation. Our engineers optimized every aspect, from placing millions of transistors to ensuring manufacturability.

Project Highlights

Physical Design of Multiple AI-driven Low Geometry ASICs
  • Custom designed chips for data center
  • Size 25+mm X 25+mm
  • Technology node 7nm and 5nm
  • Improved performance and efficiency
To Download This Resource
Fill in the details below

Reference Designs

Our Work

Innovate

Transform.

Scale

Partnerships

Device Partnerships
Digital Partnerships
Quality Partnerships
Silicon Partnerships

Company

Products & IPs